Citation: Guo-Dong Zhang, Lin Fan, Lan Bai, Min-Hui He, Lei Zhai, Song Mo. Mesoscopic Simulation Assistant Design of Immiscible Polyimide/BN Blend Films with Enhanced Thermal Conductivity[J]. Chinese Journal of Polymer Science, ;2018, 36(12): 1394-1402. doi: 10.1007/s10118-018-2155-2 shu

Mesoscopic Simulation Assistant Design of Immiscible Polyimide/BN Blend Films with Enhanced Thermal Conductivity

Guo-Dong Zhang ^1,2 ,
Lin Fan ^1,2,, ,
Lan Bai ^1,2 ,
Min-Hui He ¹ ,
Lei Zhai ¹ ,
Song Mo ¹

a.
Laboratory of Advanced Polymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
b.
School of Chemistry and Chemical Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

Corresponding author: Lin Fan, fanlin@iccas.ac.cn
Received Date: 17 April 2018
Revised Date: 7 May 2018
Accepted Date: 8 May 2018
Available Online: 12 June 2018

The mesoscopic simulation technique was applied to describe the phase separation behavior of polyimide blends and used for design of immiscible polyimide/BN blend films with enhanced thermal conductivity. The simulation equilibrium morphologies of different poly(amic acid) (PAA) blend systems were investigated and compared with optical images of corresponding polyimide blend films obtained by experiment. The immiscible polyimide blend films containing nano-/micro-sized BN with vertical double percolation structure were prepared. The result indicated that the thermal conductivity of polyimide blend film with 25 wt% nano-sized BN reached 1.16 W/(m·K), which was 236% increment compared with that of the homogenous film containing the same BN ratio. The significant enhancement in thermal conductivity was attributed to the good phase separation of polyimide matrix, which made the inorganic fillers selectively localized in one continuous phase with high packing density, consequently, forming the effective thermal conductive pathway.
- Polyimide films,
- Boron nitride,
- Mesoscopic simulation,
- Thermal conductivity
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