Citation: Li Na XU, Jian Hui LIAO, Lan HUANG, Dan Lin OU, Kai Chang ZHOU, Hai Qian ZHANG, Ning GU, Ju Zheng LIU. A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers[J]. Chinese Chemical Letters, ;2002, 13(7): 687-688. shu

A New Activation Method for Electroless Metal Plating:Palladium Laden via Bonding with Self-Assembly Monolayers

1.
National Laboratory of Molecular and Biomolecular Electronics, Southeast University, Nanjing 210096;
2.
Department of Chemistry and Chemical Engineering, Southeast University, Nanjing 210096

Received Date: 20 August 2001

Fund Project: This work was supported by the National Natural Science Foundation of China (No.69890220), Promotional Foundation of Ministry of Education of China for excellent youth teacher (2000) and Open Project Foundation of Laboratory of Solid State Microstructures of Nanjing University.

A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl₂ sensitization and roughening condition. A closely packed electroless copper film with strong adhesion is successfully fonned by AFM observation. XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.
- Palladium chemisorption,
- amino group,
- SAMs,
- activation,
- electroless plating
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